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Magazine Name : Ieee Transactions On Components Hybrids And Manufacturing Technology

Year : 1992 Volume number : 15 Issue: 01

Microcarrier For Lsi Chip Used In The Hitac M-880 Processor Group (Article)
Subject: Microcarrier , Lsi Chip , Hitac M-880 , Processor Group
Author: Takashi Inoue      Haruhiko Matsuyama     
page:      07 - 14
Microcarrier For Lsi Chip Used In The Hitac M-880 Processor Group (Article)
Subject: Hitac M-880 , Processor Group , Microcarrier , Lsi Chip
Author: Takashi Inoue      Haruhiko Matsuyama      Mamoru Tanaka     
page:      07 - 14
A Multilevel Epoxy Substrate For Flip-Clip Hybrid Multichip Module Applications (Article)
Subject: Flip-Chip , Hybrid , Multichip Module , Epoxy
Author: A. Okuno      Eiichi Tsunashima     
page:      103 - 106
Polyamic Alkyl Esters: Versatile Polyimide Precursors For Improved Dielectric Coatings (Article)
Subject: Polyamic Alkyl Esters , Versatile Polyimide Precursors , Improved Dielectric Coatings , Polyimide
Author: James L. Hendrick      Do Y. Yoon      Willi Volksen     
page:      107 - 113
Ir Microscopic Observation Of Plastic Coated Tab Inner Lead Bonds Degrading During Thermal Cycling (Article)
Subject: Thermal Cycle Stability , Inner Lead Bonding Technique , Ir Microscopic Observation , Plastic Coated Tab
Author: Peter Alpern      Rainer Tilgner     
page:      114 - 117
Critical Temperatures Of Contact Materials (Article)
Subject: Contact Material , Influence Of Cathode Temperatures , Dielectric Strength , Critical Temperature
Author: Bingjun Ding      Xiaotian Wang      Jimei Wang     
page:      118 - 120
Conducting Metallic Oxide Contacts On Superconducting Yba2 Cu3o7-X Thin Films (Article)
Subject: Conducting Metallic Oxide , Superconducting , Yba2cu3o7-X , Thin Films
Author: Wayne A Anderson      Quan-Xi Jia     
page:      121 - 125
Effect Of Adding Sn To Graphite On Electrical Contact Resistance Between Sliding Surfaces Of Graphite And Cu (Article)
Subject: Graphite , Electrical Contact , Contact Resistance , Sliding Surfaces Of Graphite And Cu
Author: Yasuo Imada      Hidetaka Ito      Koichi Nakajima     
page:      126 - 132
An Electric Double-Layer Capacitor With High Capacitance And Low Resistance (Article)
Subject: Electric Double Layer Capacitor , High Capacity , Low Resistance Contact , Capacitance
Author: Atsushi Nishino      Kiyoaki Imoto      Akihiko Yoshida      Hajime Yoneda     
page:      133 - 138
Packaging Of Gaas Signal Processors On Multichip Modules (Article)
Subject: Packaging , Gaas Processor , Signal Processing , Multichip Modules
Author: Barry K. Gilbert     
page:      15 - 28
State-Of-The-Art Multichip Modules For Avionics (Article)
Subject: The State Of The Art , Multichip Modules , Avionics , Evolutionary Systems
Author: John K. Hagge     
page:      29 - 42
A Review Of The Skin Effect As Applied To Thin Film Interconnections (Article)
Subject: Ulsi , Vlsi , Skin Effect , Thin Film
Author: Lih-Tyng Hwang      Lwona Turlik     
page:      43 - 55
Electrical Design Technology For Low Dielectric Constant Multilayer Ceramic Substrate (Article)
Subject: Low Dielectric Constant , Multilayer Cermic Capacitor , Substrate , Electrical Design Technology
Author: Akihiro Sasaki      Yuzo Shimada     
page:      56 - 62
Comparative Evaluation Of Optical Waveguides As Alternative Interconnections For High Performance Packaging (Article)
Subject: Interconnections , Optical Waveguides , Comparative Evaluation , High-Performance
Author: Lih-Tyng Hwang      Bradley D. Mccredie      Lwona Turlik     
page:      63 - 72
New Packaging Of A Chip On A Board By A Unique Printing Method (Article)
Subject: New Packaging , Chip On A Board , Unique Printing Method , Transfer Molding Packaging
Author: A. Okuno      T Hashimoto      Noritaka Oyama      Koichiro Nagai     
page:      73 - 77
A Quantitative Technique To Analyze Materials Trade-Off For Sem `E' (Article)
Subject: Sem , Trade Off , Quantitative , Analyzed
Author: Frank R. Field      Lee H. Ng     
page:      78 - 86
Resistance Computations For Multilayer Packaging Structures By Applying The Boundary Element Method (Article)
Subject: Resistance Calculation , Computational Methods , Boundary Element Method(Bem) , Multilayer Structure
Author: Ruey-Beei Wu     
page:      87 - 96
A Feasibility Study For The Fabrication Of Planar Silicon Multichip Modules Using Electron Beam Lithography For Precise Location And Interconnection Of Chips (Article)
Subject: Feasibility Study , Lithography , Electron Beam , Multichip Modules
Author: Andy Hopper      Alan Jones      Roderick Alan Augur     
page:      97 - 102